Personnel of the Faculty of Science

← Division of Physical Science
Assoc. Prof. Dr.

Phairote Sungkhaphaitoon

Associate Professor
  • p.sungkhaphaitoon@gmail.com
  • N/A
  • Material Science
  • Division of Physical Science

Education

Graduated Year
Degree
Country
2014
D.Eng. Prince of Songkla University
Thailand
2010
M.Eng. Prince of Songkla University
Thailand
2008
B.Sc. (Materials science) Prince of Songkla University
Thailand

Publication

From Scopus

Author ID: 37098032300
1
2025. Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys. Journal of Electronic Materials 54(5): 4154-4165. (cited 0 times)
2
2024. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint. Journal of Materials Science Materials in Electronics 35(1) (cited 3 times)
3
2023. The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Physics of Metals and Metallography 124(13): 1597-1605. (cited 2 times)
4
2023. Tensile Deformation Behavior of 6082-T6 Aluminum Alloy After Repair Welding by Metal Inert Gas Process. Journal of Materials Engineering and Performance 32(22): 10204-10213. (cited 1 times)
5
2023. Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium. Journal of Materials Science Materials in Electronics 34(17) (cited 7 times)
6
2022. Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn-0.7Ag-0.5Cu solder alloys. Transactions of Nonferrous Metals Society of China English Edition 32(10): 3301-3311. (cited 16 times)
7
2021. Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints. Journal of Materials Science Materials in Electronics 32(23): 27607-27624. (cited 7 times)
8
2021. Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints. Microelectronics Reliability 127 (cited 15 times)
9
2021. Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints. Transactions of Nonferrous Metals Society of China English Edition 31(5): 1397-1410. (cited 37 times)
10
2020. Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints. Russian Journal of Non Ferrous Metals 61(1): 89-98. (cited 3 times)
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Publication

From the Faculty of Science

1
สังขไพฑูรย์, ไ., สิทธิพงศ์, ศ., สิทธิพงศ์, ศ., มีงาม, ช., นิลจรัสวณิช, ณ., & พรนําพา, ณ. (2024). การทดสอบสมรรถนะหน้ากากอนามัยใช้ครั้งเดียวประเภทใช้ทางการแพทย์: คุณลักษณะทางฟิสิกส์. วารสารวิทยาศาสตร์ประยุกต์ กรมวิทยาศาสตร์บริการ, 13(1), 52-65.
2
Yordeiad, T., Chantaramanee, S., & Sungkhaphaitoon, P. (2024). Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint (SCIE). Journal Of Materials Science: Materials In Electronics, 35(1), Article number 85.
3
Sukhontapatipak, P., & Sungkhaphaitoon, P. (2023). The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder (SCIE). Physics Of Metals And Metallography, 124(13), 1597 - 1605.
4
Sukhontapatipak, P., & Sungkhaphaitoon, P. (2023). Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium (SCIE). Journal Of Materials Science: Materials In Electronics, 34(17), Article number 1327.
5
Sakkaeo, A., Chantaramanee, S., Muangjunburee, P., & Sungkhaphaitoon, P. (2023). Tensile Deformation Behavior of 6082-T6 Aluminum Alloy After Repair Welding by Metal Inert Gas Process (SCIE). Journal Of Materials Engineering And Performance, 32, 10204–10213.
6
Chantaramanee, S., & Sungkhaphaitoon, P. (2022). Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn-0.7Ag-0.5Cu solder alloys (SCIE). Transactions Of Nonferrous Metals Society Of China (english Edition), 32(10), 3301 - 3311.
7
Chantaramanee, S., & Sungkhaphaitoon, P. (2021). Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints (SCIE). Journal Of Materials Science: Materials In Electronics, 32(23), 27607-27624.
8
Chantaramanee, S., & Sungkhaphaitoon, P. (2021). Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints (SCIE). Microelectronics Reliability, 127, Article No.114421.
9
Chantaramanee, S., & Sungkhaphaitoon, P. (2021). Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints (SCIE). Transactions Of Nonferrous Metals Society Of China, 31(5), 1397-1410.
10
Sungkhaphaitoon, P., & Chantaramanee, S. (2020). Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints. Physical Metallurgy And Heat Treatment, 61(1), 89–98.
11
จันทรมณีย์, ส., & สังขไพฑูรย์, ไ. (2018). การศึกษาความสามารถการเปียกและโครงสร้างจุลภาคของโลหะบัดกรีไร้สารตะกั่ว SAC305 และ SAC305-0.5In บนวัสดุฐานทองแดง. Thai Industrial Engineering Network Journal, 4(1), 42-51.
12
Chantaramanee, S., Sriwittayakul, W., & Sungkhaphaitoon, P. (2018). Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate. Materials Science Forum, 928, 188-193.
13
Sungkhaphaitoon, P., & Chantaramanee, S. (2018). Effects of Indium Content on Microstructural, Mechanical Properties and Melting Temperature of SAC305 Solder Alloys. Russian Journal Of Non-ferrous Metals, 59(4), 385–392.
14
Sungkhaphaitoon, P., & Plookphol, T. (2018). The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy. Metallurgical Transactions A (physical Metallurgy And Materials Science), 49A, 652-660.
15
จันทรมณีย์, ส., สังขไพฑูรย์, ไ., รวยรื่น, พ., สุวรรณชาตรี, เ., & มีสุข, ว. (2018). ผลกระทบของธาตุเจืออินเดียมต่อชั้นความหนาของสารประกอบเชิงโลหะของโลหะบัดกรีไร้สารตะกั่ว Sn-3.0Ag-0.5Cu-0.5In บนวัสดุฐานทองแดง. วิศวกรรมสารฉบับวิจัยและพัฒนา, 29(2), 37-46.
16
Sungkhaphaitoon, P., Wisutmethangoon, S., & Plookphol, T. (2017). Influence of Process Parameters on Zinc Powder Produced by Centrifugal Atomisation. Materials Research, 20(3), 718-724.
17
Inkong, K., & Sungkhaphaitoon, P. (2017). Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy. Key Engineering Materials, 751, 9-13.