บุคลากรคณะวิทยาศาสตร์

รศ.ดร.

ไพโรจน์ สังขไพฑูรย์

รองศาสตราจารย์

ประวัติการศึกษา

ปีที่สำเร็จการศึกษา
วุฒิการศึกษา
ประเทศ
2557
วศ.ด (วิศวกรรมวัสดุ) มหาวิทยาลัยสงขลานครินทร์
ไทย
2553
วศ.ม. (วิศวกรรมวัสดุ) มหาวิทยาลัยสงขลานครินทร์
ไทย
2551
วท.บ. (วัสดุศาสตร์) มหาวิทยาลัยสงขลานครินทร์
ไทย

สาขาเชี่ยวชาญ / สาขาที่สนใจ

Metallurgy

Publication

ฐานข้อมูล Scopus

Author ID: 37098032300
1
Yordeiad T., Chantaramanee S., Sungkhaphaitoon P., 2024. Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint. Journal of Materials Science: Materials in Electronics 35(1) (cited 0 times)
2
Panisara Sukhontapatipak , Phairote Sungkhaphaitoon , 2023. The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Physics of Metals and Metallography 124(13): 1597-1605. (cited 0 times)
3
Sakkaeo A., Chantaramanee S., Muangjunburee P., Sungkhaphaitoon P., 2023. Tensile Deformation Behavior of 6082-T6 Aluminum Alloy After Repair Welding by Metal Inert Gas Process. Journal of Materials Engineering and Performance 32(22): 10204-10213. (cited 1 times)
4
Sukhontapatipak P., Sungkhaphaitoon P., 2023. Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium. Journal of Materials Science: Materials in Electronics 34(17) (cited 4 times)
5
CHANTARAMANEE S., SUNGKHAPHAITOON P., 2022. Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn-0.7Ag-0.5Cu solder alloys. Transactions of Nonferrous Metals Society of China (English Edition) 32(10): 3301-3311. (cited 4 times)
6
Chantaramanee S., Sungkhaphaitoon P., 2021. Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints. Microelectronics Reliability 127 (cited 13 times)
7
Chantaramanee S., Sungkhaphaitoon P., 2021. Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints. Journal of Materials Science: Materials in Electronics 32(23): 27607-27624. (cited 4 times)
8
CHANTARAMANEE S., SUNGKHAPHAITOON P., 2021. Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints. Transactions of Nonferrous Metals Society of China (English Edition) 31(5): 1397-1410. (cited 17 times)
9
Sungkhaphaitoon P., Suwansukho T., 2020. Effects of bismuth content on the microstructure, shear strength and thermal properties of Sn-0.7Cu-0.05Ni solder joints. Materials Science Forum 982 MSF: 115-120. (cited 1 times)
10
Phairote Sungkhaphaitoon , Suchart Chantaramanee , 2020. Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints. Russian Journal of Non-Ferrous Metals 61(1): 89-98. (cited 2 times)

Publication

ฐานข้อมูลคณะวิทยาศาสตร์

1
Yordeiad, T., Chantaramanee, S., & Sungkhaphaitoon, P. (2024). Interfacial microstructure, shear strength and wettability of Ni-added Sn-0.3Ag-0.7Cu/Cu solder joint (SCIE). Journal Of Materials Science: Materials In Electronics, 35(1), Article number 85.
2
Sukhontapatipak, P., & Sungkhaphaitoon, P. (2023). The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder (SCIE). Physics Of Metals And Metallography, 124(13), 1597 - 1605.
3
Sukhontapatipak, P., & Sungkhaphaitoon, P. (2023). Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium (SCIE). Journal Of Materials Science: Materials In Electronics, 34(17), Article number 1327.
4
Sakkaeo, A., Chantaramanee, S., Muangjunburee, P., & Sungkhaphaitoon, P. (2023). Tensile Deformation Behavior of 6082-T6 Aluminum Alloy After Repair Welding by Metal Inert Gas Process (SCIE). Journal Of Materials Engineering And Performance, 32, 10204–10213.
5
Chantaramanee, S., & Sungkhaphaitoon, P. (2022). Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn-0.7Ag-0.5Cu solder alloys (SCIE). Transactions Of Nonferrous Metals Society Of China (english Edition), 32(10), 3301 - 3311.
6
Chantaramanee, S., & Sungkhaphaitoon, P. (2021). Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints (SCIE). Journal Of Materials Science: Materials In Electronics, 32(23), 27607-27624.
7
Chantaramanee, S., & Sungkhaphaitoon, P. (2021). Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints (SCIE). Microelectronics Reliability, 127, Article No.114421.
8
Chantaramanee, S., & Sungkhaphaitoon, P. (2021). Influence of bismuth on microstructure, thermal properties, mechanical performance, and interfacial behavior of SAC305-xBi/Cu solder joints (SCIE). Transactions Of Nonferrous Metals Society Of China, 31(5), 1397-1410.
9
Sungkhaphaitoon, P., & Chantaramanee, S. (2020). Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints. Physical Metallurgy And Heat Treatment, 61(1), 89–98.
10
จันทรมณีย์, ส., & สังขไพฑูรย์, ไ. (2018). การศึกษาความสามารถการเปียกและโครงสร้างจุลภาคของโลหะบัดกรีไร้สารตะกั่ว SAC305 และ SAC305-0.5In บนวัสดุฐานทองแดง. Thai Industrial Engineering Network Journal, 4(1), 42-51.
11
Chantaramanee, S., Sriwittayakul, W., & Sungkhaphaitoon, P. (2018). Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate. Materials Science Forum, 928, 188-193.
12
Sungkhaphaitoon, P., & Chantaramanee, S. (2018). Effects of Indium Content on Microstructural, Mechanical Properties and Melting Temperature of SAC305 Solder Alloys. Russian Journal Of Non-ferrous Metals, 59(4), 385–392.
13
Sungkhaphaitoon, P., & Plookphol, T. (2018). The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy. Metallurgical Transactions A (physical Metallurgy And Materials Science), 49A, 652-660.
14
จันทรมณีย์, ส., สังขไพฑูรย์, ไ., รวยรื่น, พ., สุวรรณชาตรี, เ., & มีสุข, ว. (2018). ผลกระทบของธาตุเจืออินเดียมต่อชั้นความหนาของสารประกอบเชิงโลหะของโลหะบัดกรีไร้สารตะกั่ว Sn-3.0Ag-0.5Cu-0.5In บนวัสดุฐานทองแดง. วิศวกรรมสารฉบับวิจัยและพัฒนา, 29(2), 37-46.
15
Sungkhaphaitoon, P., Wisutmethangoon, S., & Plookphol, T. (2017). Influence of Process Parameters on Zinc Powder Produced by Centrifugal Atomisation. Materials Research, 20(3), 718-724.
16
Inkong, K., & Sungkhaphaitoon, P. (2017). Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy. Key Engineering Materials, 751, 9-13.